Quantum Superconductor Integration Engineer

Our dynamic and innovative new client is currently searching for a Quantum Superconductor Integration Engineer to join the team to shape the future of quantum computing. The role will involve pioneering new methods for scaling the number of qubits in a processor, exploiting novel 3D integration techniques such as TSVs, flip-chip bonding and package mode mitigation. The role will involve close collaboration with chip designers and fab experts to ensure integration of qubit chips into the 3D architecture.

Required skills for the Quantum Superconducting Integration Engineer will include:

• Superconducting Quantum knowledge and experience
• 3D integration and through-silicon-vias (TSV), flip chip bonding knowledge
• Microwave engineering experience beneficial
• Strong communication skills
• PhD/degree qualified

Please contact Rachel Anderson for further details.