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Principal Advanced Packaging Engineer: Lead FlexIC Packaging
Posted 13 days 15 hours ago by PragmatIC Semiconductor
Permanent
Full Time
Other
England, United Kingdom
Job Description
Pragmatic Semiconductor is seeking a Principal Advanced Packaging Engineer to lead the technical development of FlexIC wafer-level and chip-scale packaging, die attachment, and system integration across Sedgefield and Durham sites. The role requires deep experience in semiconductor packaging, MEMS/flexible electronics, and cross-functional collaboration.
Visa sponsorship and relocation assistance are available.
PragmatIC Semiconductor
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