Packaging Engineer - 2.5D/3D & Chiplet Systems

Steneg & Partners is seeking a Packaging Engineer to design, develop, and validate advanced semiconductor packaging solutions, including 2.5D and 3D integration, and chiplet-based architectures. You will work within multidisciplinary teams to translate innovative concepts into functional prototypes and validated demonstrators.

The role covers modelling, assembly, prototyping, testing, and collaboration with partners across the value chain to ensure robust, scalable packaging solutions for