Senior 2.5D/3D Packaging Engineer for AI Hardware

OLIX is seeking a Senior/Staff Packaging Engineer to define and deliver packaging solutions that enable our AI ASICs to become high performance systems. You will own end to end package design, lead 2.5D/3D architectures, run PI/SI simulations, and collaborate across die, substrate, and board levels to ensure manufacturability and system readiness.

This hands-on role offers impact from architecture through production, with exposure to advanced packaging technologies and cross functional teams.