Process Engineer (OSAT)

Hours:38.5 hours per week
Monday - Thursday: 0830 - 1700, Friday: 08:30 - 1530

Reporting to:Lead Engineer (OSAT)

About this Role

• To function as an engineer within a key section of CIL's Semiconductor Packaging capability - either Wafer Process, Die Bond, Wire Bond or Encapsulation.
• To support the process Lead Engineers in ensuring the operation, development and continual maintenance of all aspects of the assigned Semiconductor Packaging process activity and its equipment.

PRIMARY ROLES & RESPONSIBILITIES

• Production Support: support/advise on clean room and production team supervision, equipment/technical matters, training and development; train and evaluate Production-led training of operators, supervisors and technicians; troubleshoot problems with equipment and/or assembly/product quality as identified by Production; write equipment operational SOPs for production reference and training; write product assembly instructions and publish supporting documents for Production Team reference
• Preventative Maintenance: define and document low level Daily and Weekly and higher level Monthly Quarterly maintenance tasks as part of standard operational procedures; define and monitor schedules for DWMQ maintenance tasks to ensure equipment maintenance schedules are met; support the Maintenance Team to ensure equipment annual service requirements are met; support the Maintenance Team in fault-find, repair and support of service engineers in event of equipment breakdown; use occurrences of equipment breakdown or process drift to identify opportunities for improvement; support Senior and Lead Engineers, senior management and IT teams to identify and maintain stocks of critical spares, machine consumables, and to ensure programs or other process-critical software is backed up to a CIL server location, or other suitable and safe storage media, for ease of retrieval as and when required.
• Process Design and Set-up: review customer documents and materials to build prototypes for new and existing customers; support the New Product Introduction program with the build of new products; design, set-up and document new product assembly processes and produce NPI batches for customer evaluation; evaluate new product assembly processes for quantity uplift and design/implement improvements for increased throughput; support the Lead and Senior Engineers to highlight potential issues concerning Design for Manufacture.
• Process Engineering: monitor and evaluate production process short-term/long-term performance using Cpk and Ppk statistics; evaluate suitability of measurement systems for CTQ product measurables; design and implement systems to collect manufacturing data from equipment and measurement systems; collect and use production data to monitor product CTQs using control chart statistics and SPC to ensure established processes are operating within agreed/acceptable limits; statistical analysis of production data to identify and implement opportunities for improvement; support the Lead and Senior Engineers and senior management in identifying the need for manufacturing equipment and equipment specifications/configurations; attend in-person first-user on-site training sessions as provided by equipment suppliers.
• Quality Support: provide technical support for internal/external auditors; advise on measurement system calibration requirements and support collection/despatch of items for external calibration; support Quality Team investigations into PRN data, help identify root causes and implement improvements; support with Quality 8D investigations, help identify root causes and implement improvements; support Quality Team with design and continuous evaluation of PFMEA documents.
• Research & Development: Design trials/tests to better understand existing processes and/or assemblies and identify improvements; identify training needs and design training/development plans to continuously improve team capabilities/knowledge; carry out research projects on subject areas of personal/team interest and report findings to improve team/company knowledge; attend exhibitions and shows when required to maintain contacts with suppliers and ensure an up-to-date knowledge of the "state of the art" in aspects of semiconductor packaging process; use knowledge from process and equipment development projects, monitoring of established production processes to support the Lead Engineer and drive improvements in semiconductor process.

• Minimum Education: An HNC or HND in a relevant engineering or scientific discipline.
• Preferable Education: A degree qualification; BEng/MEng in engineering or scientific disciplines e.g. electronics, physics, mechanical engineering.
• Minimum Experience: 1 year working in an engineering and/or manufacturing facility.
• Preferable Experience: 2 years working with an electronics, microelectronics or semiconductor manufacturing facility.