IC Package Design Engineer - High-Speed & 2.5D/3D Packaging

Qualcomm in Cambridge is seeking an IC Package Design Engineer to join their Central Hardware Systems Team. This role involves responsibilities such as designing and optimizing package layouts, collaborating with multi-functional teams, and driving innovations in packaging technology.

The ideal candidate will have a Bachelor's or Master's degree in Engineering and experience with Cadence Allegro tools.

Competitive salary and comprehensive benefits package include stock options, family leave, and various insurance benefits.