Director of Semiconductor Packaging

A growing semiconductor client is currently seeking a Director of Semiconductor Packaging to lead the development of advanced, high-performance packaging solutions for GaN power semiconductors. The role combines technical leadership, people leadership and hands on engineering. The successful candidate will set the packaging strategy, build team capability, influence company-wide decisions and work closely with internal teams and external packaging/manufacturing partners.

Key Responsibilities

• Lead the design and development of high-performance, high-density semiconductor packages for GaN power products
• Develop technologies including wirebond, flip-chip, embedded packaging and wafer back end processes
• Balance electrical, thermal, mechanical, cost, quality and form factor requirements
• Lead packaging development with overseas assembly houses and technology suppliers
• Support package verification, qualification, reliability and thermal testing
• Drive design for manufacture, design processes and engineering tools to achieve right first time designs
• Conduct first article inspection and failure analysis
• Provide packaging expertise to Applications Engineering and customers
• Contribute significantly to the product and technology roadmap
• Build external networks and maintain awareness of state of the art semiconductor packaging

Essential Experience & Skills

• Degree or higher in Engineering, Physics, Materials Science or a related discipline
• Strong experience designing and manufacturing high volume semiconductor power packages, including working with overseas assembly houses
• Deep knowledge of packaging technologies including:
  • Die attach / Ag sintering
  • Flip chip
  • Wire bonding
  • Copper clip
  • PCB embedding
  • Chip metallisation
• Strong 3D CAD experience and knowledge of supplier design rules/DFM
• Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent
• Experience with thermal characterisation of semiconductor packages
• Experience with package qualification/reliability testing, including TCoB, MSL, TC, HAST and HTS, against relevant standards
• Strong cross functional leadership and supplier management skills
• Ability to manage priorities independently and deliver results
• Confident presenting technical results to internal and external stakeholders