Cryogenic 3D Packaging Lead for Quantum Modules

Jobtailor seeks a senior packaging and R&D leader to drive 3D integration for multi-chip quantum modules. You will build and guide a team across packaging, signal integrity, materials, and quantum integration, coordinating with external foundries and research partners to deliver robust, cryogenic-ready solutions.

Your work will balance rapid prototyping with rigorous reliability, yield, and long-term stability, partnering with design, process integration, cryo R&D, and quantum hardware teams.